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A metamorphic high electron-mobitity transistor with reflowed submicron T-Gate for high-speed optoelectronics applications

dc.citation.epage283en_US
dc.citation.spage281en_US
dc.contributor.authorLien, YCen_US
dc.contributor.authorChang, EYen_US
dc.contributor.authorChu, LXen_US
dc.contributor.authorChang, HCen_US
dc.contributor.authorLee, CSen_US
dc.contributor.authorChen, SHen_US
dc.contributor.authorLin, YCen_US
dc.contributor.authorLee, HMen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:26:16Z
dc.date.available2014-12-08T15:26:16Z
dc.date.issued2003en_US
dc.description.abstractA metamorphic high electron-mobility transistor (HEMT) manufactured with reflowed submicron T-gate using E-beam lithography for high-speed optoelectronics applications is developed. The In0.53Al0.47As/InGaAs HEMT uses InxAl1-xAs as the buffer layer between GaAs substrate and the InP lattice-matched HEMT structure. The T-gate developed has a gate length of 0.1 mum. The fabricated metamorphic HEMT has a saturation drain current of 280mA/mrn and a transconductance of 840mS/mm at V-DS=1.2V Noise figure for 160 mum gate-width device is less than 1 dB and the associated gain is up to 14dB at 18GHz. The device demonstrates a cut-off frequency f(T) of 150GHz and a maximum frequency f(MAX) up to 350GHz. The metamorphic HEMT developed has the potential for high-speed optoelectronics applications.en_US
dc.identifier.isbn0-7803-7887-3en_US
dc.identifier.journalPROCEEDINGS OF THE SIXTH CHINESE OPTOELECTRONICS SYMPOSIUMen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/18653
dc.identifier.wosnumberWOS:000189300100077
dc.language.isoen_USen_US
dc.titleA metamorphic high electron-mobitity transistor with reflowed submicron T-Gate for high-speed optoelectronics applicationsen_US
dc.typeProceedings Paperen_US

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