Abnormal ESD failure mechanism in high-pin-count BGA packaged ICs due to stressing nonconnected balls
| dc.citation.epage | 31 | en_US |
| dc.citation.issue | 1 | en_US |
| dc.citation.spage | 24 | en_US |
| dc.citation.volume | 4 | en_US |
| dc.contributor.author | Lo, WY | en_US |
| dc.contributor.author | Ker, MD | en_US |
| dc.contributor.department | 電機學院 | zh_TW |
| dc.contributor.department | College of Electrical and Computer Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:39:34Z | |
| dc.date.available | 2014-12-08T15:39:34Z | |
| dc.date.issued | 2004-03-01 | en_US |
| dc.description.abstract | An abnormal failure mechanism due to ESD pulse applied on the nonconnected (NC) solder balls of a high-pin-count (683 balls) BGA packaged chipset IC is presented. The ESD test results of the IC product were found below human-body-model (HBM) 2 kV when stressing all balls or only stressing NC balls, but above HBM 3 kV when stressing all balls excluding NC balls. Failure analyses, including scanning electron microscopy (SEM) photographs and the measurement of current waveforms during ESD discharging event, have been performed. With a new proposed equivalent model, a clear explanation on this unusual phenomenon is found to have a high correlation to the small capacitor method (SCM). Several solutions to overcome this failure mechanism are also discussed. | en_US |
| dc.identifier.doi | 10.1109/TDMR.2004.824362 | en_US |
| dc.identifier.issn | 1530-4388 | en_US |
| dc.identifier.journal | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1109/TDMR.2004.824362 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/27010 | |
| dc.identifier.wosnumber | WOS:000220708500005 | |
| dc.language.iso | en_US | en_US |
| dc.subject | ball grid array (BGA) | en_US |
| dc.subject | charged-device model (CDM) | en_US |
| dc.subject | electrostatic discharge (ESD) | en_US |
| dc.subject | scanning electron microscopy (SEM) | en_US |
| dc.subject | small capacitor method (SCM) | en_US |
| dc.title | Abnormal ESD failure mechanism in high-pin-count BGA packaged ICs due to stressing nonconnected balls | en_US |
| dc.type | Article; Proceedings Paper | en_US |