Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications
| dc.citation.epage | 1210 | en_US |
| dc.citation.issue | 4 | en_US |
| dc.citation.spage | 1207 | en_US |
| dc.citation.volume | 18 | en_US |
| dc.contributor.author | Hu, JC | en_US |
| dc.contributor.author | Chang, TC | en_US |
| dc.contributor.author | Wu, CW | en_US |
| dc.contributor.author | Chen, LJ | en_US |
| dc.contributor.author | Hsiung, CS | en_US |
| dc.contributor.author | Hsieh, WY | en_US |
| dc.contributor.author | Lur, W | en_US |
| dc.contributor.author | Yew, TR | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:45:07Z | |
| dc.date.available | 2014-12-08T15:45:07Z | |
| dc.date.issued | 2000-07-01 | en_US |
| dc.description.abstract | Effects of a new combination of additives in acid electroplating solution on the properties of Cu thin films have been investigated, The electroplated Cu films exhibit an excellent superfilling behavior. 0.18 mu m vias with an aspect ratio exceeding 5 were filled completely without any void or seam. Strong (111) texture was found for the electroplated Cu films. The resistivity of a 450-nm-thick Cu film was measured to be 1.84 mu Omega cm. (C) 2000 American Vacuum Society. [S0734-2101(00)08004-0]. | en_US |
| dc.identifier.doi | 10.1116/1.582326 | en_US |
| dc.identifier.issn | 0734-2101 | en_US |
| dc.identifier.journal | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1116/1.582326 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/30432 | |
| dc.identifier.wosnumber | WOS:000088276800033 | |
| dc.language.iso | en_US | en_US |
| dc.title | Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications | en_US |
| dc.type | Article; Proceedings Paper | en_US |