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攜手Arm半導體教育聯盟,培養未來世代晶片設計所需的創新關鍵技術與優秀人才庫

dc.citation.issue064期en_US
dc.contributor.author秘書處zh_TW
dc.date.accessioned2024-03-17T23:39:42Z
dc.date.available2024-03-17T23:39:42Z
dc.date.issued2024-01-15en_US
dc.description.abstract繼與美國普渡大學達成台美半導體人才躍升計畫(Taiwan-U.S. Semiconductor Workforce Advancement Program, SWAP)協議後,本校再攜手全球知名運算平台大廠安謀(Arm)的半導體教育聯盟zh_TW
dc.identifier.journal陽明交大電子報zh_TW
dc.identifier.journalNYCU E-NEWSen_US
dc.identifier.urihttps://www.nycu.edu.tw/nycu/ch/app/news/view?module=headnews&id=2994&serno=b6feb913-8e1c-4516-9d01-c475e8218050en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/162660
dc.language.isozh_TWen_US
dc.publisher國立陽明交通大學zh_TW
dc.publisherNational Yang Ming Chiao Tung Universityen_US
dc.title攜手Arm半導體教育聯盟,培養未來世代晶片設計所需的創新關鍵技術與優秀人才庫zh_TW
dc.typeHistorical Newsen_US

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