低溫無接面多晶矽電晶體技術開發
| dc.contributor.author | 黃調元 | en_US |
| dc.contributor.author | HUANG TIAO-YUAN | en_US |
| dc.contributor.department | 國立交通大學電子工程學系及電子研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:31:03Z | |
| dc.date.available | 2014-12-13T10:31:03Z | |
| dc.date.issued | 2013 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC102-2221-E009-133 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=3086753&docId=415126 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/90668 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 低溫無接面多晶矽電晶體技術開發 | zh_TW |
| dc.title | Development of Low-Temperature Junctionless Poly-Si Device Technologies | en_US |
| dc.type | Plan | en_US |
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