Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration
| dc.citation.epage | 79 | en_US |
| dc.citation.spage | 79 | en_US |
| dc.citation.woscount | 0 | en_US |
| dc.contributor.author | Chen, Kuan-Neng | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2019-04-02T06:04:16Z | |
| dc.date.available | 2019-04-02T06:04:16Z | |
| dc.date.issued | 2018-01-01 | en_US |
| dc.identifier.journal | 2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT) | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/151067 | |
| dc.identifier.wosnumber | WOS:000458919700023 | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration | en_US |
| dc.type | Proceedings Paper | en_US |
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