Scrap rules for small lots in wafer fabrication
| dc.citation.epage | 190 | en_US |
| dc.citation.spage | 187 | en_US |
| dc.contributor.author | Wu, MC | en_US |
| dc.contributor.author | Chiou, CW | en_US |
| dc.contributor.author | Hsu, HM | en_US |
| dc.contributor.department | 工業工程與管理學系 | zh_TW |
| dc.contributor.department | Department of Industrial Engineering and Management | en_US |
| dc.date.accessioned | 2014-12-08T15:26:38Z | |
| dc.date.available | 2014-12-08T15:26:38Z | |
| dc.date.issued | 2002 | en_US |
| dc.description.abstract | This paper presents a genetic algorithm for determining the-rules for scrapping small lots in a semiconductor fab. Small lots are lots which carry less than 25 wafers due to yield problem. Simulation results show that the proposed approach can increase contribution margin up to 24% in the case of low yield and high average, selling price. | en_US |
| dc.identifier.isbn | 0-7803-7604-8 | en_US |
| dc.identifier.journal | 2002 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/18933 | |
| dc.identifier.wosnumber | WOS:000182423700032 | |
| dc.language.iso | en_US | en_US |
| dc.title | Scrap rules for small lots in wafer fabrication | en_US |
| dc.type | Proceedings Paper | en_US |
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