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定位定量黏著封裝方法與結構

dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumber201034092zh_TW
dc.contributor.author邱俊誠en_US
dc.contributor.author侯冠州en_US
dc.contributor.author林君穎en_US
dc.contributor.author張志瑋en_US
dc.date.accessioned2014-12-16T06:12:39Z
dc.date.available2014-12-16T06:12:39Z
dc.date.issued2010-09-16en_US
dc.description.abstract有鑑於習知流體自組裝技術利用親疏水性材料來輔助微小元件定位,本發明提出一種定位定量黏著封裝方法與結構,也就是先將液態膠定位方法,本發明先將第一基板劃分出親水性區域與疏水性區域,點上液態膠於第一基板親水區域上,再利用第二基板靠近第一基板,先保留一間隙於兩基板間,使液態膠藉由毛細現象之吸引力流動分佈於親水性區域,最後,選擇是否將第二基板移開或接合第一基板,若選擇後者,可將第二基板做微流道或置容孔之設計,以有助於後段製程時微小晶粒之定位,並且可防止溢膠的情況產生。zh_TW
dc.identifier.govdocH01L021/56zh_TW
dc.identifier.govdocH01L023/28zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/103699
dc.language.isozh_TWen_US
dc.title定位定量黏著封裝方法與結構zh_TW
dc.typePatentsen_US

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