植入式醫療電子元件生物相容性封裝製程開發(I)
| dc.contributor.author | 陳柏均 | zh_TW |
| dc.contributor.author | Chen Po-Chun | en_US |
| dc.contributor.department | 國立交通大學電子工程學系及電子研究所 | zh_TW |
| dc.date.accessioned | 2016-03-28T08:17:39Z | |
| dc.date.available | 2016-03-28T08:17:39Z | |
| dc.date.issued | 2015 | en_US |
| dc.description.sponsorship | 科技部 | zh_TW |
| dc.identifier.govdoc | MOST104-2622-E009-016-CC2 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=11478172&docId=462807 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/130284 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 植入式醫療電子元件生物相容性封裝製程開發(I) | zh_TW |
| dc.title | Development of Biocompatible Packaging Process for Medical Electronics Implants (I) | en_US |
| dc.type | Plan | en_US |
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