微機電系統校際整合研究---子計畫三：玻璃結合及感測器之評估

dc.contributor.author	黃宇中	en_US
dc.contributor.author	HUANG YU-CHUNG	en_US
dc.contributor.department	國立交通大學電子工程學系	zh_TW
dc.date.accessioned	2014-12-13T10:39:03Z
dc.date.available	2014-12-13T10:39:03Z
dc.date.issued	1996	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC85-2215-E009-031	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=234610&docId=43066	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/96027
dc.language.iso	zh_TW	en_US
dc.subject	陽極結合	zh_TW
dc.subject	測試	zh_TW
dc.subject	感測器	zh_TW
dc.subject	Anodic bonding	en_US
dc.subject	Testing	en_US
dc.subject	Sensor	en_US
dc.title	微機電系統校際整合研究---子計畫三：玻璃結合及感測器之評估	zh_TW
dc.title	Sub-Project: Glass Bonding and Evaluation of Sensor Performance	en_US
dc.type	Plan	en_US

Files

Now showing 1 - 1 of 1