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薄膜型微波通訊被動元件之設計與製作---子計畫II:高介電薄膜型微波通訊被動元件之研製(III)

dc.contributor.author林鵬en_US
dc.contributor.authorLIN PANGen_US
dc.contributor.department交通大學材料科學與工程系zh_TW
dc.date.accessioned2014-12-13T10:35:04Z
dc.date.available2014-12-13T10:35:04Z
dc.date.issued2002en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC91-2219-E009-028zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=744978&docId=141171en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/93194
dc.language.isozh_TWen_US
dc.title薄膜型微波通訊被動元件之設計與製作---子計畫II:高介電薄膜型微波通訊被動元件之研製(III)zh_TW
dc.titleHigh-Dielectric Thin-Film Microwave Communication Devices(III)en_US
dc.typePlanen_US

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