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高性能混合訊號式介面積體電路-子計畫二:射頻電路之靜電放電防護技術與高速高低壓界面電路之研發(III)

dc.contributor.author柯明道en_US
dc.contributor.authorKER MING-DOUen_US
dc.contributor.department交通大學電子工程研究所zh_TW
dc.date.accessioned2014-12-13T10:32:33Z
dc.date.available2014-12-13T10:32:33Z
dc.date.issued2004en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC93-2215-E009-014zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=1026645&docId=195165en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/91609
dc.language.isozh_TWen_US
dc.title高性能混合訊號式介面積體電路-子計畫二:射頻電路之靜電放電防護技術與高速高低壓界面電路之研發(III)zh_TW
dc.titleDevelopment of On-Chip ESD Protection Technique for GHz RF Circuits and High-Speed Mixed-Voltage Interface Circuits(III)en_US
dc.typePlanen_US

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