前瞻電信微波科技發展計畫---子計畫三：前瞻性三維微波被動元件與模組研發(II)
| dc.contributor.author | 鍾世忠 | en_US |
| dc.contributor.author | CHUNG SHYH-JONG | en_US |
| dc.contributor.department | 交通大學電信工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:30:50Z | |
| dc.date.available | 2014-12-13T10:30:50Z | |
| dc.date.issued | 2005 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC94-2752-E009-003-PAE | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=1085981&docId=204608 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/90477 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 前瞻電信微波科技發展計畫---子計畫三：前瞻性三維微波被動元件與模組研發(II) | zh_TW |
| dc.title | Advanced Tri-Dimensional Microwave Passives and Modules(II) | en_US |
| dc.type | Plan | en_US |