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INTEGRATED CONTACTLESS SIGNAL TRANSFER APPARATUS

dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20150111492zh_TW
dc.contributor.authorCHUNG Shyh-Jongen_US
dc.contributor.authorWANG Hsiao-Ningen_US
dc.date.accessioned2015-05-12T02:59:49Z
dc.date.available2015-05-12T02:59:49Z
dc.date.issued2015-04-23en_US
dc.description.abstractAn integrated contactless signal transfer apparatus makes use of the rule of filter design to transfer signal from a chip to the transmission lines of a PCB. The integrated contactless signal transfer apparatus includes a substrate, a chip disposed on the substrate, a first resonator unit disposed on the chip for receiving a first signal with a first frequency generated from the chip, a PCB positioned at a distance opposite to the substrate, and a second resonator unit disposed on the PCB. The first signal passes through the first resonator unit to generate a contactless coupling between the first and second resonator units, so the second resonator unit generates a second signal. The second signal has a second frequency substantially equal to the first frequency.zh_TW
dc.identifier.govdocH04W004/00zh_TW
dc.identifier.govdocH04B005/00zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/122848
dc.language.isozh_TWen_US
dc.titleINTEGRATED CONTACTLESS SIGNAL TRANSFER APPARATUSzh_TW
dc.typePatentsen_US

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