<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

凸塊接點之電阻測量結構及包含其之封裝基板

dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumberI439704zh_TW
dc.contributor.author陳智en_US
dc.contributor.author張元蔚en_US
dc.date.accessioned2014-12-16T06:12:17Z
dc.date.available2014-12-16T06:12:17Z
dc.date.issued2014-06-01en_US
dc.identifier.govdocG01R027/08zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/103564
dc.language.isozh_TWen_US
dc.title凸塊接點之電阻測量結構及包含其之封裝基板zh_TW
dc.typePatentsen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
I439704.pdf
Size:
738.67 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: