驅動微波混成IC組裝技術至毫米波頻段(II)
| dc.contributor.author | 莊晴光 | en_US |
| dc.contributor.author | TZUANG CHING-KUANG C | en_US |
| dc.contributor.department | 交通大學電信工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:48:21Z | |
| dc.date.available | 2014-12-13T10:48:21Z | |
| dc.date.issued | 2000 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC89-2213-E009-063 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=542274&docId=99630 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/101315 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 微波混成積體電路 | zh_TW |
| dc.subject | 組裝技術 | zh_TW |
| dc.subject | Microwave hybrid integrated circuit | en_US |
| dc.subject | Assembly technology | en_US |
| dc.title | 驅動微波混成IC組裝技術至毫米波頻段(II) | zh_TW |
| dc.title | Moving Microwave Hybrid Integrated Circuit Assembly Technology toward Millimeter-Wave Regime (II) | en_US |
| dc.type | Plan | en_US |
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