Analysis and prevention on NC-ball induced ESD damages in a 683-pin BGA packaged chipset IC
| dc.citation.epage | 1588 | en_US |
| dc.citation.issue | 9-11 | en_US |
| dc.citation.spage | 1583 | en_US |
| dc.citation.volume | 43 | en_US |
| dc.contributor.author | Lo, WY | en_US |
| dc.contributor.author | Ker, MD | en_US |
| dc.contributor.department | 電機學院 | zh_TW |
| dc.contributor.department | College of Electrical and Computer Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:40:26Z | |
| dc.date.available | 2014-12-08T15:40:26Z | |
| dc.date.issued | 2003-09-01 | en_US |
| dc.description.abstract | An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed. (C) 2003 Elsevier Ltd. All rights reserved. | en_US |
| dc.identifier.doi | 10.1016/S0026-2714(03)00278-6 | en_US |
| dc.identifier.issn | 0026-2714 | en_US |
| dc.identifier.journal | MICROELECTRONICS RELIABILITY | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1016/S0026-2714(03)00278-6 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/27601 | |
| dc.identifier.wosnumber | WOS:000185791500039 | |
| dc.language.iso | en_US | en_US |
| dc.title | Analysis and prevention on NC-ball induced ESD damages in a 683-pin BGA packaged chipset IC | en_US |
| dc.type | Article; Proceedings Paper | en_US |