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閘極堆疊結構及包含其之金屬氧化物半導體元件及閘極堆疊結構之製造方法

dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumberI505468zh_TW
dc.contributor.author林岳欽en_US
dc.contributor.author張翼en_US
dc.contributor.author莊庭維en_US
dc.date.accessioned2015-12-04T07:03:32Z
dc.date.available2015-12-04T07:03:32Z
dc.date.issued2015-10-21en_US
dc.description.abstract一種電晶體之閘極堆疊結構,包含:一基板;一半導體層,設置於該基板上;一閘極介電層,設置於該半導體層上,其中該閘極介電層係包含由氧化鑭(La2O3)、氧化鉿(HfO2)及包含氧化鑭/氧化鉿之該半導體層之一上表面層所組成之複合氧化物層;以及一閘極電極層,設置於該閘極介電層上。zh_TW
dc.identifier.govdocH01L029/78zh_TW
dc.identifier.govdocH01L029/40zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/128795
dc.language.isozh_TWen_US
dc.title閘極堆疊結構及包含其之金屬氧化物半導體元件及閘極堆疊結構之製造方法zh_TW
dc.typePatentsen_US

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