Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam
| dc.citation.epage | 48 | en_US |
| dc.citation.issue | en_US | |
| dc.citation.spage | 42 | en_US |
| dc.citation.volume | 74 | en_US |
| dc.citation.woscount | 3 | |
| dc.contributor.author | Liu, Tao-Chi | en_US |
| dc.contributor.author | Chen, Chih | en_US |
| dc.contributor.author | Chiu, Kuo-Jung | en_US |
| dc.contributor.author | Lin, Han-Wen | en_US |
| dc.contributor.author | Kuo, Jui-Chao | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:28:53Z | |
| dc.date.available | 2014-12-08T15:28:53Z | |
| dc.date.issued | 2012-12-01 | en_US |
| dc.description.abstract | We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing. (C) 2012 Elsevier Inc. All rights reserved. | en_US |
| dc.identifier.doi | 10.1016/j.matchar.2012.09.002 | en_US |
| dc.identifier.issn | 1044-5803 | en_US |
| dc.identifier.journal | MATERIALS CHARACTERIZATION | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1016/j.matchar.2012.09.002 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/20865 | |
| dc.identifier.wosnumber | WOS:000311986400005 | |
| dc.language.iso | en_US | en_US |
| dc.subject | Focused ion beam (FIB) | en_US |
| dc.subject | Intermetallic compound | en_US |
| dc.subject | Sample preparation | en_US |
| dc.subject | Image quality | en_US |
| dc.subject | Electron backscatter diffraction (EBSD) | en_US |
| dc.title | Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam | en_US |
| dc.type | Article | en_US |