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三維電阻抗斷層攝影方法

dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumber201641076zh_TW
dc.contributor.author蔡 德明en_US
dc.date.accessioned2016-12-20T05:04:29Z
dc.date.available2016-12-20T05:04:29Z
dc.date.issued2016-12-01en_US
dc.description.abstract本發明系揭露一種三維電阻抗斷層攝影方法,三維電阻抗斷層攝影方法包含在待測物中設置一植入本體,植入本體上設置有複數個電極形成之電極陣列;設置一電極控制器以控制電極陣列中任一電極;藉由結合電流操控技術或虛擬電極技術,以產生更多獨立的複數個在同一曲面上之複數個電極上所量測到的阻抗資料;以及進行一演算,以將複數個水平或垂直阻抗資料轉換形成一三維電阻抗斷層攝影影像。zh_TW
dc.identifier.govdocA61B005/053zh_TW
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/132328
dc.language.isozh_TWen_US
dc.title三維電阻抗斷層攝影方法zh_TW
dc.typePatentsen_US

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