三維堆疊複晶矽非揮發性記憶體元件技術與分析
| dc.contributor.author | 崔秉鉞 | en_US |
| dc.contributor.author | Tsui Bing-Yue | en_US |
| dc.contributor.department | 國立交通大學電子工程學系及電子研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:31:03Z | |
| dc.date.available | 2014-12-13T10:31:03Z | |
| dc.date.issued | 2013 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC102-2221-E009-158-MY3 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=3084122&docId=414361 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/90664 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 三維堆疊複晶矽非揮發性記憶體元件技術與分析 | zh_TW |
| dc.title | Device Technology and Characterization of Poly-Si Non-volatile Memory for 3D Stack | en_US |
| dc.type | Plan | en_US |
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