驅動微波混成IC組裝技術至毫米波頻段(I)

dc.contributor.author	莊晴光	en_US
dc.contributor.author	TZUANG CHING-KUANG C	en_US
dc.contributor.department	交通大學電信工程系	zh_TW
dc.date.accessioned	2014-12-13T10:37:15Z
dc.date.available	2014-12-13T10:37:15Z
dc.date.issued	1999	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC88-2213-E009-101	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=429311&docId=76855	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/94483
dc.language.iso	zh_TW	en_US
dc.subject	毫米波	zh_TW
dc.subject	包裝電晶體	zh_TW
dc.subject	印刷電路板	zh_TW
dc.subject	行波放大器	zh_TW
dc.subject	振盪器	zh_TW
dc.subject	混成微波組裝	zh_TW
dc.subject	Millimeter wave	en_US
dc.subject	Packaged transistor	en_US
dc.subject	PCB	en_US
dc.subject	Traveling-wave amplifier (TWA)	en_US
dc.subject	Osillator	en_US
dc.subject	Hybrid microwave assembly	en_US
dc.title	驅動微波混成IC組裝技術至毫米波頻段(I)	zh_TW
dc.title	Moving Microwave Hybrid Integrated Circuit Assembly Technology Toward Millimeter-Wave Regime (I)	en_US
dc.type	Plan	en_US

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