NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs
| dc.citation.epage | 1384 | en_US |
| dc.citation.spage | 1379 | en_US |
| dc.contributor.author | Lee, Yu-Min | en_US |
| dc.contributor.author | Wu, Tsung-Heng | en_US |
| dc.contributor.author | Huang, Pei-Yu | en_US |
| dc.contributor.author | Yang, Chi-Ping | en_US |
| dc.contributor.department | 交大名義發表 | zh_TW |
| dc.contributor.department | National Chiao Tung University | en_US |
| dc.date.accessioned | 2018-08-21T05:56:55Z | |
| dc.date.available | 2018-08-21T05:56:55Z | |
| dc.date.issued | 2013-01-01 | en_US |
| dc.description.abstract | By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup. | en_US |
| dc.identifier.issn | 1530-1591 | en_US |
| dc.identifier.journal | DESIGN, AUTOMATION & TEST IN EUROPE | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/146840 | |
| dc.identifier.wosnumber | WOS:000415129400267 | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs | en_US |
| dc.type | Proceedings Paper | en_US |
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