晶片系統國家型科技計畫研究成果產學橋接計畫( III )

dc.contributor.author	李鎮宜	en_US
dc.contributor.author	LEE CHEN-YI	en_US
dc.contributor.department	國立交通大學電子工程學系及電子研究所	zh_TW
dc.date.accessioned	2014-12-13T10:41:44Z
dc.date.available	2014-12-13T10:41:44Z
dc.date.issued	2012	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC101-2220-E009-001	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=2411759&docId=383294	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/98689
dc.language.iso	zh_TW	en_US
dc.title	晶片系統國家型科技計畫研究成果產學橋接計畫( III )	zh_TW
dc.title	Academic-Industry Bridging Project for National System-On-Chip Program	en_US
dc.type	Plan	en_US

Files

Now showing 1 - 1 of 1