Molding structure with independent thermal control and its molding method
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20100239701 | zh_TW |
| dc.contributor.author | Chen, Ren Haw | en_US |
| dc.contributor.author | Liou, An Cheng | en_US |
| dc.date.accessioned | 2014-12-16T06:15:32Z | |
| dc.date.available | 2014-12-16T06:15:32Z | |
| dc.date.issued | 2010-09-23 | en_US |
| dc.description.abstract | The present invention, in accordance with the shrinking behavior of heat-melt material during cooling and demolding of molding process, presents a molding structure with electrical heating lines embedded on the surface of the molding structure which allows the structure to provide independent thermal control. By allowing the mold to control its surface temperature, the thermal stress between the heat-melt material and the mold can be eliminated and balanced, thereby preventing the heat-melt material from damage by the gripping force during demolding process. | zh_TW |
| dc.identifier.govdoc | B29C035/00 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/105380 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | Molding structure with independent thermal control and its molding method | zh_TW |
| dc.type | Patents | en_US |