Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding Technology
| dc.citation.epage | 38 | en_US |
| dc.citation.spage | 35 | en_US |
| dc.citation.woscount | 0 | en_US |
| dc.contributor.author | Tsai, Tsung-Yen | en_US |
| dc.contributor.author | Chang, Yao-Jen | en_US |
| dc.contributor.author | Chen, Kuan-Neng | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2017-04-21T06:48:45Z | |
| dc.date.available | 2017-04-21T06:48:45Z | |
| dc.date.issued | 2015 | en_US |
| dc.description.abstract | A submicron of Ni/Sn transient liquid phase bonding at low temperature was investigated to surmount nowadays fine-pitch Cu/Sn process challenge. After bonding process, only uniform and high-temperature stable Ni3Sn4 intermetallic compound was existed. In addition, the advantages of this scheme showed excellent electrical and reliability performance and mechanical strength. | en_US |
| dc.identifier.isbn | 978-1-4799-9928-6 | en_US |
| dc.identifier.issn | 1946-1550 | en_US |
| dc.identifier.journal | PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015) | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/136094 | |
| dc.identifier.wosnumber | WOS:000380466200011 | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding Technology | en_US |
| dc.type | Proceedings Paper | en_US |
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