薄閘氧化層深次微米n-MOS元件的熱載子可靠性分析

dc.contributor.author莊紹勳en_US
dc.contributor.authorChung Steve Sen_US
dc.contributor.department交通大學電子工程系zh_TW
dc.date.accessioned2014-12-13T10:37:00Z
dc.date.available2014-12-13T10:37:00Z
dc.date.issued1999en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC88-2215-E009-041zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=418054&docId=74156en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/94333
dc.language.isozh_TWen_US
dc.subject熱載子zh_TW
dc.subject可靠度zh_TW
dc.subject氧化層zh_TW
dc.subject金氧半場效電晶體zh_TW
dc.subject深次微米zh_TW
dc.subject洩漏電流zh_TW
dc.subjectHot carrieren_US
dc.subjectReliabilityen_US
dc.subjectOxided largeren_US
dc.subjectMOSFETen_US
dc.subjectDeep submicrometeren_US
dc.subjectLeakage currenten_US
dc.title薄閘氧化層深次微米n-MOS元件的熱載子可靠性分析zh_TW
dc.titleAnalysis of Hot Carrier Reliability for Thin Gate Oxide Deep-Submicron nMOSFET'sen_US
dc.typePlanen_US

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