高性能混合訊號積體電路與系統之設計與研製---總計畫(I)

dc.contributor.author	吳重雨	en_US
dc.contributor.author	CHUNG-YUWU	en_US
dc.contributor.department	交通大學電子工程系	zh_TW
dc.date.accessioned	2014-12-13T10:38:38Z
dc.date.available	2014-12-13T10:38:38Z
dc.date.issued	1997	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC86-2221-E009-079	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=293688&docId=53783	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/95568
dc.language.iso	zh_TW	en_US
dc.subject	混合訊號積體電路	zh_TW
dc.subject	射頻發射接收晶片	zh_TW
dc.subject	類神經網路	zh_TW
dc.subject	影像處理	zh_TW
dc.subject	無線電話	zh_TW
dc.subject	低電壓	zh_TW
dc.subject	低功率	zh_TW
dc.subject	高速積體電路	zh_TW
dc.subject	Mixed signal IC	en_US
dc.subject	Transceiver IC	en_US
dc.subject	Neural network	en_US
dc.subject	Image processing	en_US
dc.subject	Cordless telephone	en_US
dc.subject	Low voltage	en_US
dc.subject	Low power	en_US
dc.subject	High speed IC	en_US
dc.title	高性能混合訊號積體電路與系統之設計與研製---總計畫(I)	zh_TW
dc.title	The Design and Implementation of High-Performance Mixed-Signal Integrated Circuits and Systems(I)	en_US
dc.type	Plan	en_US

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