Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
| dc.citation.epage | 32 | en_US |
| dc.citation.spage | 32 | en_US |
| dc.contributor.author | Juang, Jing-Ye | en_US |
| dc.contributor.author | Chu, Yi-Cheng | en_US |
| dc.contributor.author | Lu, Chia-Ling | en_US |
| dc.contributor.author | Chen, Chih | en_US |
| dc.contributor.author | Tu, King-Ning | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2018-08-21T05:56:49Z | |
| dc.date.available | 2018-08-21T05:56:49Z | |
| dc.date.issued | 2017-01-01 | en_US |
| dc.description.abstract | In this study, a low temperature solid state diffusion bonding process with (111) highly oriented nano-twined Cu (nt-Cu) was proposed. A less void bonding interface was observed reveals a good bonding quality for the bonded samples. In addition, a large quasisingle grain was identified in the bonded film. Based on these results, it is believed that high strength and durable bonding structure can be accomplished by bonding two highly (111)-oriented nt-Cu films. | en_US |
| dc.identifier.journal | 2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/146685 | |
| dc.identifier.wosnumber | WOS:000404249700032 | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu | en_US |
| dc.type | Proceedings Paper | en_US |
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