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適用於GHz頻段之輸出入靜電放電防護技術與銲墊設計

dc.contributor.author柯明道en_US
dc.contributor.authorKER MING-DOUen_US
dc.contributor.department交通大學電子工程研究所zh_TW
dc.date.accessioned2014-12-13T10:35:44Z
dc.date.available2014-12-13T10:35:44Z
dc.date.issued2001en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC90-2215-E009-053zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=665649&docId=126360en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/93575
dc.language.isozh_TWen_US
dc.subject射頻積體電路zh_TW
dc.subject靜電放電zh_TW
dc.subject靜電防護zh_TW
dc.subject高頻zh_TW
dc.subjectRadio frequency integrated circuit (RF IC)en_US
dc.subjectElectrostatic discharge (ESD)en_US
dc.subjectElectrostatic protectionen_US
dc.subjectHigh frequencyen_US
dc.title適用於GHz頻段之輸出入靜電放電防護技術與銲墊設計zh_TW
dc.titleElectrostatic Discharge (ESD) Protection and Low-Capacitance Bond Pad for GHz RF Integrated Circuitsen_US
dc.typePlanen_US

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