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Transient-induced latchup in CMOS technology: Physical mechanism and device simulation

dc.citation.epage940en_US
dc.citation.spage937en_US
dc.contributor.authorKer, MDen_US
dc.contributor.authorHsu, SFen_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.date.accessioned2014-12-08T15:25:43Z
dc.date.available2014-12-08T15:25:43Z
dc.date.issued2004en_US
dc.description.abstractThe physical mechanism of (t) under bar ransient-induced (l) under bar atch (u) under barp (TLU) in CMOS ICs has been clearly characterized by device simulation and experimental verification in time domain perspective. An underdamped sine-wave-like voltage has been clarified as the real TLU-triggering stimulus under system-level (e) under bar lectro (s) under bar tatic (d) under bar ischarge (ESD) test. The specific "sweep-back" current caused by the minority carriers stored within the pnpn structure of CMOS ICs has been qualitatively proved to be the major cause of TLU.en_US
dc.identifier.isbn0-7803-8684-1en_US
dc.identifier.journalIEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGESTen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/18127
dc.identifier.wosnumberWOS:000227158500216
dc.language.isoen_USen_US
dc.titleTransient-induced latchup in CMOS technology: Physical mechanism and device simulationen_US
dc.typeProceedings Paperen_US

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