Joule heating effect under accelerated electromigration in flip-chip solder joints
| dc.citation.epage | 666 | en_US |
| dc.citation.spage | 663 | en_US |
| dc.contributor.author | Chiu, S. H. | en_US |
| dc.contributor.author | Liang, S. W. | en_US |
| dc.contributor.author | Chen, Chili | en_US |
| dc.contributor.author | Yao, D. J. | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:24:57Z | |
| dc.date.available | 2014-12-08T15:24:57Z | |
| dc.date.issued | 2006 | en_US |
| dc.description.abstract | This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration. | en_US |
| dc.identifier.doi | 10.1109/ECTC.2006.1645721 | en_US |
| dc.identifier.isbn | 1-4244-0151-8 | en_US |
| dc.identifier.issn | 0569-5503 | en_US |
| dc.identifier.journal | 56th Electronic Components & Technology Conference 2006, Vol 1 and 2, Proceedings | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1109/ECTC.2006.1645721 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/17333 | |
| dc.identifier.wosnumber | WOS:000238566600104 | |
| dc.language.iso | en_US | en_US |
| dc.title | Joule heating effect under accelerated electromigration in flip-chip solder joints | en_US |
| dc.type | Proceedings Paper | en_US |