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無線通訊用積層微波陶瓷元件之研發---總計畫(II)

dc.contributor.author林鵬en_US
dc.contributor.authorLIN PANGen_US
dc.contributor.department交通大學材料科學與工程研究所zh_TW
dc.date.accessioned2014-12-13T10:36:59Z
dc.date.available2014-12-13T10:36:59Z
dc.date.issued1999en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC88-2213-E009-068zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=418315&docId=74216en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/94325
dc.language.isozh_TWen_US
dc.subject無線通訊zh_TW
dc.subject微波陶瓷元件zh_TW
dc.subject厚膜zh_TW
dc.subject介電常數zh_TW
dc.subject燒結zh_TW
dc.subjectWireless communicationen_US
dc.subjectMicrowave ceramic deviceen_US
dc.subjectThick filmen_US
dc.subjectDielectric constanten_US
dc.subjectFiringen_US
dc.title無線通訊用積層微波陶瓷元件之研發---總計畫(II)zh_TW
dc.titleMultilayer Microwave Ceramic Device for Wireless Communication (II)en_US
dc.typePlanen_US

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