THERMAL DISSIPATION SUBSTRATE
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20120273803 | zh_TW |
| dc.contributor.author | Wu YewChung Sermon | en_US |
| dc.contributor.author | Chang Tai-Min | en_US |
| dc.contributor.author | Chiu Yu Chia | en_US |
| dc.contributor.author | Hu Jen-Li | en_US |
| dc.date.accessioned | 2014-12-16T06:15:05Z | |
| dc.date.available | 2014-12-16T06:15:05Z | |
| dc.date.issued | 2012-11-01 | en_US |
| dc.description.abstract | The present invention related to a method for manufacturing a thermal dissipation substrate and a thermal dissipation substrate. The method includes steps of: (a) providing a substrate body having a surface; (b) forming a plurality of concave regions on the surface; and (c) filling the plurality of concave regions with a plurality of diamond materials. The thermal dissipation substrate includes: a substrate having a surface at a first horizontal; a plurality of regions formed on the surface at a second horizontal; and a plurality of diamond materials having a relatively high thermal coefficient and disposed on the plurality of regions. | zh_TW |
| dc.identifier.govdoc | H01L029/02 | zh_TW |
| dc.identifier.govdoc | H01L021/50 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/105124 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | THERMAL DISSIPATION SUBSTRATE | zh_TW |
| dc.type | Patents | en_US |