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半導體裝置及其製作方法

dc.citation.patentcountryTWNen_US
dc.citation.patentnumber201801157en_US
dc.contributor.author簡昭欣zh_TW
dc.contributor.author劉繼文zh_TW
dc.contributor.author周承翰zh_TW
dc.date.accessioned2019-04-11T06:06:41Z
dc.date.available2019-04-11T06:06:41Z
dc.date.issued2018-01-01en_US
dc.description.abstract半導體裝置包含鰭片式場效電晶體裝置,且此鰭片式場效電晶體裝置包含延伸於第一方向中與從基材層突伸出之鰭片式結構。鰭片式結構包含形成於基材層上之主體應力層與設置於主體應力層上之通道層。氧化層形成於基材層上,且突伸遠離通道層。源極-汲極(source-drain;SD)應力結構設置於氧化層上之通道層的側壁上。包含有閘極電極層與閘極介電層之閘極堆疊覆蓋部分之通道層,且延伸於與第一方向垂直之第二方向中。zh_TW
dc.identifier.govdocH01L021/28en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/151424
dc.language.isozh_TWen_US
dc.title半導體裝置及其製作方法zh_TW
dc.typePatentsen_US

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