覆晶銲錫接點電遷移孔洞生成機制之研究
| dc.contributor.author | 陳智 | en_US |
| dc.contributor.author | Chen Chih | en_US |
| dc.contributor.department | 交通大學材料科學與工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:29:25Z | |
| dc.date.available | 2014-12-13T10:29:25Z | |
| dc.date.issued | 2006 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC95-2218-E009-022 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=1192378&docId=225645 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/89262 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 覆晶銲錫接點電遷移孔洞生成機制之研究 | zh_TW |
| dc.title | Mechanisms of Void Formation of Flip-Chip Solder Joints during Electromigration | en_US |
| dc.type | Plan | en_US |
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