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Compact Electromagnetic Bandgap Surfaces with Lumped Elements

dc.citation.epage820en_US
dc.citation.spage818en_US
dc.contributor.authorTsai, Po-Chengen_US
dc.contributor.authorMalcolm Ng Mou Kehnen_US
dc.contributor.department傳播研究所zh_TW
dc.contributor.departmentInstitute of Communication Studiesen_US
dc.date.accessioned2014-12-08T15:30:48Z
dc.date.available2014-12-08T15:30:48Z
dc.date.issued2012en_US
dc.description.abstractLumped elements connected between adjacent elements of a periodic mushroom-type electromagnetic bandgap (EBG) structure are used in a bid for strong miniaturization by pulling the EBG into the required frequency range. Since analyzing the high impedance surface structure from equivalent circuit, we can use the dispersion diagram to demonstrate the effects of tunable lumped element.en_US
dc.identifier.isbn978-1-4577-1330-9en_US
dc.identifier.journal2012 ASIA-PACIFIC MICROWAVE CONFERENCE (APMC 2012)en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/22006
dc.identifier.wosnumberWOS:000319213700269
dc.language.isoen_USen_US
dc.subjectElectromagnetic bandgap (EBG) surfaceen_US
dc.subjectdispersion diagramen_US
dc.subjectlumped elementen_US
dc.titleCompact Electromagnetic Bandgap Surfaces with Lumped Elementsen_US
dc.typeProceedings Paperen_US

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