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Soft breakdown enhanced hysteresis effects in ultra-thin oxide SOI nMOSFETs

dc.citation.epage408en_US
dc.citation.spage404en_US
dc.contributor.authorChen, MCen_US
dc.contributor.authorTsai, CWen_US
dc.contributor.authorGu, SHen_US
dc.contributor.authorWang, THen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:26:38Z
dc.date.available2014-12-08T15:26:38Z
dc.date.issued2002en_US
dc.description.abstractThe impact of soft breakdown location on V, hysteresis in partially depleted SOI nMOSFETs with ultra-thin oxide (1.6nm) is investigated. Two breakdown enhanced hysteresis modes are identified. In a channel breakdown MOSFET, excess holes attributed to valence electron tunneling flow to the floating body and thus cause V, hysteresis in gate bias switching. As a contrast, in a drainedge breakdown device, enhanced V, hysteresis is observed during drain bias switching because of increased band-to-band tunneling current.en_US
dc.identifier.isbn0-7803-7352-9en_US
dc.identifier.journal40TH ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUMen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/18936
dc.identifier.wosnumberWOS:000176016400065
dc.language.isoen_USen_US
dc.titleSoft breakdown enhanced hysteresis effects in ultra-thin oxide SOI nMOSFETsen_US
dc.typeProceedings Paperen_US

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