覆加銅層之厚膜銀基導體研究
| dc.contributor.author | 邱碧秀 | en_US |
| dc.contributor.author | CHIOU BI-SHIOU | en_US |
| dc.contributor.department | 國立交通大學電子工程研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:39:38Z | |
| dc.date.available | 2014-12-13T10:39:38Z | |
| dc.date.issued | 1995 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC84-2215-E009-053 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=169492&docId=28445 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/96692 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 覆加銅層之厚膜銀基導體研究 | zh_TW |
| dc.title | Cu-Modified Thick Film Ag-Based Conductor | en_US |
| dc.type | Plan | en_US |
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