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電路板高效率熱模型之建立及程式庫化

dc.contributor.author張隆國en_US
dc.contributor.department國立交通大學電機與控制工程學系zh_TW
dc.date.accessioned2014-12-13T10:37:30Z
dc.date.available2014-12-13T10:37:30Z
dc.date.issued1999en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC88-2215-E009-059zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=451215&docId=82105en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/94683
dc.language.isozh_TWen_US
dc.subject積體電路熱模型zh_TW
dc.subject印刷電路板zh_TW
dc.subject最佳化zh_TW
dc.subject暫態時間模擬zh_TW
dc.subject漸近近似波形模擬法zh_TW
dc.subjectIC thermal modelen_US
dc.subjectPCBen_US
dc.subjectOptimizationen_US
dc.subjectTransient time simulationen_US
dc.subjectAsymptotic waveform emulation (AWE)en_US
dc.title電路板高效率熱模型之建立及程式庫化zh_TW
dc.titleEfficient Library Design of the Thermal Model of PCB'sen_US
dc.typePlanen_US

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