Characterization of Silicon Photonics Modulator Integration and High Efficiency Testing Platform
| dc.citation.epage | 0 | en_US |
| dc.citation.spage | 0 | en_US |
| dc.citation.woscount | 0 | en_US |
| dc.contributor.author | Chen, Shang-Chun | en_US |
| dc.contributor.author | Wun, Sin-Jhu | en_US |
| dc.contributor.author | Hsu, Chih-Hsiang | en_US |
| dc.contributor.author | Lin, Chen-Yu | en_US |
| dc.contributor.author | Zhang, Jie | en_US |
| dc.contributor.author | Ku, Kai-Ning | en_US |
| dc.contributor.author | Chang, Po-Chih | en_US |
| dc.contributor.author | Wang, Chung-Chih | en_US |
| dc.contributor.author | Chen, Wei-Yen | en_US |
| dc.contributor.author | Lee, Tai-Hsin | en_US |
| dc.contributor.author | Huang, Chien-Ying | en_US |
| dc.contributor.author | Chen, Ting-Hui | en_US |
| dc.contributor.author | Lee, Ming-Chang | en_US |
| dc.contributor.author | Lin, Chien-Chung | en_US |
| dc.contributor.department | 光電系統研究所 | zh_TW |
| dc.contributor.department | Institute of Photonic System | en_US |
| dc.date.accessioned | 2020-10-05T02:01:30Z | |
| dc.date.available | 2020-10-05T02:01:30Z | |
| dc.date.issued | 2019-01-01 | en_US |
| dc.description.abstract | We successfully establish a silicon photonics device manufacturing and testing platform in 200mm SOI wafer. We integrate modulator and driver chip to show 30Gbis PAM4 capability. A fully-automatic wafer level characterization process is built up for all optical devices in surface coupling method. | en_US |
| dc.identifier.isbn | 978-1-7281-0905-3 | en_US |
| dc.identifier.issn | 1949-2081 | en_US |
| dc.identifier.journal | 2019 IEEE 16TH INTERNATIONAL CONFERENCE ON GROUP IV PHOTONICS (GFP 2019) | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/155281 | |
| dc.identifier.wosnumber | WOS:000556110200001 | en_US |
| dc.language.iso | en_US | en_US |
| dc.subject | silicon photonics | en_US |
| dc.subject | modulator | en_US |
| dc.subject | wafer level measurement | en_US |
| dc.title | Characterization of Silicon Photonics Modulator Integration and High Efficiency Testing Platform | en_US |
| dc.type | Proceedings Paper | en_US |
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