Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package
| dc.citation.epage | 10 | en_US |
| dc.citation.spage | 10 | en_US |
| dc.citation.woscount | 0 | en_US |
| dc.contributor.author | Yang, Kai-Ming | en_US |
| dc.contributor.author | Chou, Tzu-Chieh | en_US |
| dc.contributor.author | Ko, Cheng-Ta | en_US |
| dc.contributor.author | Lin, Chen-Hao | en_US |
| dc.contributor.author | Chen, Yu-Hua | en_US |
| dc.contributor.author | Tseng, Tzyy-Jang | en_US |
| dc.contributor.author | Wu, Wen-Wei | en_US |
| dc.contributor.author | Chen, Kuan-Neng | en_US |
| dc.contributor.department | 交大名義發表 | zh_TW |
| dc.contributor.department | National Chiao Tung University | en_US |
| dc.date.accessioned | 2019-12-13T01:12:49Z | |
| dc.date.available | 2019-12-13T01:12:49Z | |
| dc.date.issued | 2019-01-01 | en_US |
| dc.description.abstract | In this paper, low temperature (190-220 degrees C) Cu-Cu gang bonding at a low vacuum pressure is demonstrated. The low temperature technologies can be applied to the RDL-first Fan-Out panel level package (FOPLP). | en_US |
| dc.identifier.isbn | 978-4-904743-07-2 | en_US |
| dc.identifier.journal | PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/153257 | |
| dc.identifier.wosnumber | WOS:000492018300010 | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package | en_US |
| dc.type | Proceedings Paper | en_US |
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