<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Stochastic Thermal Simulation Considering Spatial Correlated Within-Die Process Variations

dc.citation.epage36en_US
dc.citation.spage31en_US
dc.contributor.authorHuang, Pei-Yuen_US
dc.contributor.authorWu, Jia-Hongen_US
dc.contributor.authorLee, Yu-Minen_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.date.accessioned2014-12-08T15:24:35Z
dc.date.available2014-12-08T15:24:35Z
dc.date.issued2009en_US
dc.description.abstractIn this work, we develop a statistical thermal simulator including the effect of spatial correlation under within-die process variations. This method utilizes the Karhunen-Loeve (KL) expansion to model the physical parameters, and apply the Polynomial Chaoses (PCs) and the stochastic Galerkin method to tackle stochastic heat transfer equations. We demonstrate the accuracy and efficiency of our simulator by comparing with the Monte Carlo simulation, and point out that the stochastic thermal analysis is essential to provide a robust estimation of temperature distribution for the thermal-aware design flow.en_US
dc.identifier.isbn978-1-4244-2748-2en_US
dc.identifier.journalPROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/17051
dc.identifier.wosnumberWOS:000265675400006
dc.language.isoen_USen_US
dc.titleStochastic Thermal Simulation Considering Spatial Correlated Within-Die Process Variationsen_US
dc.typeProceedings Paperen_US

Files

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: