An efficient improvement for barrier effect of W-filled contact
| dc.citation.epage | 1119 | en_US |
| dc.citation.issue | 2B | en_US |
| dc.citation.spage | 1115 | en_US |
| dc.citation.volume | 35 | en_US |
| dc.contributor.author | Yeh, WK | en_US |
| dc.contributor.author | Chan, KY | en_US |
| dc.contributor.author | Chang, TC | en_US |
| dc.contributor.author | Tsai, MH | en_US |
| dc.contributor.author | Chen, SH | en_US |
| dc.contributor.author | Chen, MC | en_US |
| dc.contributor.author | Lin, MS | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:02:53Z | |
| dc.date.available | 2014-12-08T15:02:53Z | |
| dc.date.issued | 1996-02-01 | en_US |
| dc.description.abstract | A post chemical vapor deposition of tungsten (CVD-W) treatment by N-2 plasma is proposed to suppress the WAl12 formation during subsequent thermal annealing, which improves the thermal stability of W-filled contact. Selective CVD-W is employed to fill the contact hole. Following W deposition, in situ N-2 plasma treatment is performed prior to Al alloy metallization. It is shown that this post CVD-W treatment efficiently suppresses the formation of WAl12, resulting in an improvement of the barrier capability of W-filled contact. | en_US |
| dc.identifier.doi | 10.1143/JJAP.35.1115 | en_US |
| dc.identifier.issn | 0021-4922 | en_US |
| dc.identifier.journal | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1143/JJAP.35.1115 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/1491 | |
| dc.identifier.wosnumber | WOS:A1996UD94100068 | |
| dc.language.iso | en_US | en_US |
| dc.subject | CVD-W | en_US |
| dc.subject | diffusion barrier | en_US |
| dc.subject | W nitride | en_US |
| dc.subject | thermal stability | en_US |
| dc.title | An efficient improvement for barrier effect of W-filled contact | en_US |
| dc.type | Article; Proceedings Paper | en_US |