前瞻電信微波科技發展計畫---子計畫三：前瞻性三維微波被動元件與模組研發(III)

dc.contributor.author	鍾世忠	en_US
dc.contributor.author	CHUNG SHYH-JONG	en_US
dc.contributor.department	交通大學電信工程系	zh_TW
dc.date.accessioned	2014-12-13T10:29:43Z
dc.date.available	2014-12-13T10:29:43Z
dc.date.issued	2006	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC95-2752-E009-003-PAE	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=1237626&docId=228167	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/89578
dc.language.iso	zh_TW	en_US
dc.title	前瞻電信微波科技發展計畫---子計畫三：前瞻性三維微波被動元件與模組研發(III)	zh_TW
dc.title	Advanced Tri-Dimensional Microwave Passives and Modules(III)	en_US
dc.type	Plan	en_US

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