CMP晶圓壓力分佈實測技術的研究與應用
| dc.contributor.author | 鄭璧瑩 | en_US |
| dc.contributor.department | 國立交通大學機械工程研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:51:24Z | |
| dc.date.available | 2014-12-13T10:51:24Z | |
| dc.date.issued | 2000 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC89-2212-E009-063 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=573413&docId=107055 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/102669 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | CMP晶圓壓力分佈實測技術的研究與應用 | zh_TW |
| dc.title | The Investigation of Measurement Technology on CMP Wafer Pressure Distribution | en_US |
| dc.type | Plan | en_US |