Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization
| dc.citation.epage | 1227 | en_US |
| dc.citation.issue | 11 | en_US |
| dc.citation.spage | 1222 | en_US |
| dc.citation.volume | 32 | en_US |
| dc.contributor.author | Hsu, YC | en_US |
| dc.contributor.author | Shao, TL | en_US |
| dc.contributor.author | Yang, CJ | en_US |
| dc.contributor.author | Chen, C | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:40:08Z | |
| dc.date.available | 2014-12-08T15:40:08Z | |
| dc.date.issued | 2003-11-01 | en_US |
| dc.description.abstract | This paper investigates the electromigration-induced failures of SnAg3.8Cu0.7 flip-chip solder joints. An under-bump metallization (UBM) of a Ti/Cr-Cu/Cu trilayer was deposited on the chip side, and a Cu/Ni(P)/Au pad was deposited on the BT board side. Electromigration damages were observed in the bumps under a current density of 2 x 10(4) A/cm(2) and 1 x 10(4) A/cm(2) at 100 degreesC and 150 degreesC. The failures were found to be at the cathode/chip side, and the current crowding effect played an important role in the failures. Copper atoms were found to move in the direction of the electron flow to form intermetallic compounds (IMCs) at the interface of solder and pad metallization as a result of current stressing. | en_US |
| dc.identifier.issn | 0361-5235 | en_US |
| dc.identifier.journal | JOURNAL OF ELECTRONIC MATERIALS | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/27414 | |
| dc.identifier.wosnumber | WOS:000186990100015 | |
| dc.language.iso | en_US | en_US |
| dc.subject | electromigration | en_US |
| dc.subject | flip chip | en_US |
| dc.subject | under-bump metallization | en_US |
| dc.subject | BT board | en_US |
| dc.subject | current crowding | en_US |
| dc.subject | intermetallic compounds | en_US |
| dc.title | Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization | en_US |
| dc.type | Article; Proceedings Paper | en_US |