Effects of current crowding and Joule heating on reliability of solder joints

dc.citation.epage	193	en_US
dc.citation.spage	180	en_US
dc.citation.volume	945	en_US
dc.contributor.author	Liang, S. W.	en_US
dc.contributor.author	Chiu, S. H.	en_US
dc.contributor.author	Chen, Chih	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.date.accessioned	2014-12-08T15:06:49Z
dc.date.available	2014-12-08T15:06:49Z
dc.date.issued	2007	en_US
dc.description.abstract	This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration.	en_US
dc.identifier.isbn	978-0-7354-0459-5	en_US
dc.identifier.issn	0094-243X	en_US
dc.identifier.journal	STRESS-INDUCED PHENOMENA IN METALLIZATION	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/5346
dc.identifier.wosnumber	WOS:000252104700017
dc.language.iso	en_US	en_US
dc.subject	electromigration	en_US
dc.subject	flip-chip solder joints	en_US
dc.subject	Joule heating	en_US
dc.title	Effects of current crowding and Joule heating on reliability of solder joints	en_US
dc.type	Article	en_US

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