THROUGHPUT PERFORMANCE OF MULTISTAGE INTERCONNECTION NETWORKS IN PRESENCE OF MULTIPLE MEMORY HOT SPOTS
| dc.citation.epage | 537 | en_US |
| dc.citation.issue | 8 | en_US |
| dc.citation.spage | 536 | en_US |
| dc.citation.volume | 26 | en_US |
| dc.citation.woscount | 1 | |
| dc.contributor.author | LEE, TH | en_US |
| dc.contributor.department | 交大名義發表 | zh_TW |
| dc.contributor.department | 電信工程研究所 | zh_TW |
| dc.contributor.department | National Chiao Tung University | en_US |
| dc.contributor.department | Institute of Communications Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:05:35Z | |
| dc.date.available | 2014-12-08T15:05:35Z | |
| dc.date.issued | 1990-04-12 | en_US |
| dc.identifier.issn | 0013-5194 | en_US |
| dc.identifier.journal | ELECTRONICS LETTERS | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/4128 | |
| dc.identifier.wosnumber | WOS:A1990DB40700026 | |
| dc.language.iso | en_US | en_US |
| dc.title | THROUGHPUT PERFORMANCE OF MULTISTAGE INTERCONNECTION NETWORKS IN PRESENCE OF MULTIPLE MEMORY HOT SPOTS | en_US |
| dc.type | Article | en_US |