Electrical Connecting Element and Method for Manufacturing the Same
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20140217593 | zh_TW |
| dc.contributor.author | CHEN Chih | en_US |
| dc.contributor.author | LIU Taochi | en_US |
| dc.contributor.author | HUANG Yi-Sa | en_US |
| dc.contributor.author | LIU Chien-Min | en_US |
| dc.date.accessioned | 2014-12-16T06:14:45Z | |
| dc.date.available | 2014-12-16T06:14:45Z | |
| dc.date.issued | 2014-08-07 | en_US |
| dc.description.abstract | An electrical connecting element for connecting a first substrate and a second substrate and a method for manufacturing the same are disclosed. The method of the present invention comprises: (A) providing a first substrate and a second substrate, wherein a first copper film is formed on the first substrate, a first metal film is formed on the second substrate, a first connecting surface of the first copper film has a (111)-containing surface, and the first metal film has a second connecting surface; and (B) connecting the first copper film and the first metal film to form an interconnect, wherein the first connecting surface of the first copper film is faced to the second connecting surface of the first metal film. | zh_TW |
| dc.identifier.govdoc | H01L023/00 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/104879 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | Electrical Connecting Element and Method for Manufacturing the Same | zh_TW |
| dc.type | Patents | en_US |